7th International Conference on Electronics, Communication and Aerospace Technology

ICECA 2023


22-24, November 2023

Coimbatore, India

IEEE logo IEEE Madras Section
IEEE XPLORE COMPLIANT ISBN: 979-8-3503-4060-0
IEEE DVD ISBN: 979-8-3503-4059-4

ICECA Previous Edition : 2022

ICECA 2023 in IEEE : Click here

rvs tc logo
RVS Technical Campus
Coimbatore, India

ABOUT THE COLLEGE

The RVS Technical campus intends to be the preeminent research and teaching institution linking the people of our institutions to the nation and the world by providing quality, career focused education and world class specializations. To be a world class Institution for Engineering and Managerial Education by imparting quality education of global standards and formulate students academically superior, socially committed, ethically strong and culturally rich citizens.



Keynote Information

Dr. K. Porkumaran

Chairman, IEEE Madras Section and Principal & Senior Professor,
Sri Sairam Engineering College, Chennai, India.

Dr. T. Muthumanickam

Chair - Aerospace and Electronic Systems (AES) Society, IEEE Madras Section.

Mr.S.Ayyappan

Senior Manager - Avionics Design, HAL,
Bangalore.



Important Dates

Final Paper Submission Due: 30 September, 2023
Registration Due: 10 October, 2023
Conference: 22-24, November 2023

General Information


scope


The 7th International Conference on Electronics, Communication and Aerospace Technology [ICECA 2023] organized on 22-24, November 2023 by RVS Technical Campus, Coimbatore, Tamil Nadu, India is a premier international conference that aims to promote the recent innovations in various fields of engineering and technology. ICECA 2023 provides a common platform for latest developments, inventive research works and issues to be discussed and experimented for future collaboration, amongst the researchers, academicians and industrialists across the globe. The main objective of the ICECA 2023 conference is to present the latest research and results of scientists, research scholars and students related to Electronics, Communication and Aerospace technologies for future collaboration. This ICECA 2023 conference provides an extensive opportunity for the researchers to discuss, share and exchange the research innovations on the advances in evolving fields of Artificial Intelligence, Machine Learning, Deep Learning, Fog/Edge Computing and so on

Conference Committee







General Chairs

Dr. S. Vijayan,
Principal,
RVS Technical Campus,
Coimbatore, India.

Program Chair

Dr. S Narayanamoorthy,
HoD - Mechatronics

Tutorial and Workshop Chairs

Dr. S Sridhar, HoD - Automobile Engineering

Dr. D Rajkumar, HoD - Agri

Local Arrangement Chair

Dr. A G Mohandas Gandhi, HoD - Civil

Conference Chair

Dr. S D Prabu Ragavendiran, RVS Technical Campus, India.


Steeringcommittee


Oversight Committee Members:

  • Dr. S D Prabu Ragavendiran, RVS Technical Campus, India.
  • Dr. Shajulin Benedict, Indian Institute of Information Technology, India.
  • Dr. K. Porkumaran, Chairman, IEEE Madras Section and Principal and Senior Professor, Sri Sairam Engineering College, Chennai, India.
  • Dr. T. Muthumanickam, Aerospace and Electronic Systems, IEEE Madras Section, India.
  • Mr. M. Arun, IEEE Execom Member, IEEE Madras Section.

  • Technical Committee:

  • Dr. A. Khaled A Kamel, Texas Southern University, USA.
  • Dr. Reijo Savola, VTT Research Centre, Finland.
  • Dr. Asif Hassan, Khulna University of Engineering and Technology, Bangladesh.
  • Dr. Laila El Abbadi, IbnTofail University, Morocco.
  • Dr. Giovanni Mazzeo, University Parthenope, Italy.
  • Dr. Patrick Goh, Universiti Sains, Malaysia.
  • Dr. Robert Bestak, Czech Technical University, Czech Republic.
  • Dr. Youssouf EL ALLIOUI, Hassan University, Morocco.
  • Dr. Vasile Avram, Bucharest University, Romania.
  • Dr. Eric David Cohen, University of Campinas School of Applied Sciences, Brazil.
  • Dr. Isabel Santiago Chiquero, Universidad de Córdoba, Córdoba.
  • Dr. Gharsallah Zaineb, University of Tunis El Manar, Tunisia.
  • Dr. Ahmet Cakanel, The Ohio State University, USA.
  • Dr. Edoardo Patti, Polytechnic University of Turin, Italy.
  • Dr. Mohammed Babiker Ali, Albutana University, Sudan.
  • Dr. George A. Kyriacou, Democritus University of Thrace, Greece.
  • Dr. Akhtar Kalam, Victoria University, Australia.
  • Dr. Kuo-Chung Chen, National Chung-Shan Institute of Science and Technology, China.
  • Dr. Cheng-Kuan Lin, Soochow University, China.
  • Dr. AZM Ehtesham Chowdhury, American Intl. University, Bangladesh.
  • Dr. Luis Gerardo de la Fraga, Cinvestav Av. Instituto Politécnico Nacional, Mexico.
  • Dr. Qian Chen, Southeast University, China.
  • Dr. Gustavo Medeiros Freitas, Federal University of Santa Catarina, Brazil.
  • Dr. Gharsallah Zaineb, University of Tunis El Manar, Tunisia.
  • Dr. Vinoth Kanna, Guru Nanak Institute of Technology, India.
  • Dr. R. Harikumar, Bannari Amman Institute of Technology, India.
  • Dr. N. Mohan Kumar, SKP Engineering College, India.
  • Dr. Naveen Kumar, FCS Railenium, Valenciennes, France.
  • Call for Paper

    Communication Technologies

    Digital Communication Technologies

    Satellite Communication Technologies

    Wireless Network Communication Technologies

    Mobile Communication

    Mobile Ad-hoc Networks

    Computer Network Communications

    Communication Modeling Theories and Practices

    5G Communication and Networks

    Green Communication Systems

    Network and Information Security Techniques

    Multimedia Communication Frameworks

    Microwave Communication Networks and Technologies

     

     

     

    Electronics

    Digital Electronics

    Power and Applied Electronics

    Electro Technologies

    Nanoelectronics and Microelectronics

    Semiconductor Technologies

    Power Electronics and Drive Systems

    Power Systems Reliability and Security

    Real-time Systems

    Cognitive Electronics

    Applied Electronics

    Advanced VLSI Systems

    Advanced Computer Architectures

    Embedded Processors and Networking

    Artificial Intelligence and Expert Systems

    Navigational Electronics

    Mechatronics

    Artificial Intelligence Technology and Applications

    Cognitive Science

    Cognitive Theories and Applications

    Natural Language Processing

    Machine Learning Techniques

    Deep Learning Technologies

    Decision Support Systems

    Automated Expert Systems

    Intelligent Information Systems

    AI and Evolutionary Algorithms

    Neural Networks and Applications

    Intelligent user Interface Technologies

    Robotics

    Adaptive Control Systems

    Mobile and Autonomous Systems

    Multi-agent Collaborative Systems

    Robotics and Engineering Applications

    Brain-Machine Interfaces

    Networked Robotics

    Multi Robotic Systems

    Distributed Systems

    Nanobots and Novel Sensors

    Robotics and Industrial Monitoring

    Virtual Systems

    Aerospace Technologies

    Advances in Aerospace Technologies

    Aerospace Robotics and Mechatronics

    Aviation Human Factors

    Aerodynamic Forces and Flexibility

    Aircraft Mapping and Navigation

    Ballistic Tracking Technologies

    Aerospace Communication Techniques

    Remote Sensing Technologies





    Paper Submission

    Prospective contributors are invited to submit full papers in DOC / DOCX / PDF format, with a maximum page length of 8 pages in double column by including all the figures, tables, and references. The paper must adhere to the standard IEEE paper template, and no bibliography should be included at the conclusion. Papers that are not in accordance with the IEEE template by including appropriate reference/citation, or that exceed the page limit will not be processed to the next stage. Nevertheless, only the research articles that have neither appeared elsewhere for publication, nor are under review for another refereed conference publication will be considered. The study topic, primary research findings, and contributions should be clearly stated in the article.

    Submission Method

    The full research paper should be only submitted to the conference email iceacconfteam@gmail.com

    Paper Template

    click here to download MS Word Template
    click here to download LaTex Template

    https://www.ieee.org/conferences/publishing/templates.html

    When submitting a research paper, authors agree that if their work is accepted, they will submit a camera-ready version of the updated paper for inclusion in the final ICECA 2023 proceedings and will present the paper at the conference. By the time the camera-ready article is submitted for inclusion in the proceedings, each approved contribution must have one paid registration.

    The decision on the submitted manuscript will be sent to the authors via Email after the completion of review process. The acceptance ID given in the acceptance should be included in all the future conversations.

    For the full call for papers of ICECA 2023: Call for Papers

    Submission Deadline: Refer Conference Homepage

    Papers that are accepted will be allocated to a normal technical session. All articles will be subjected to a comprehensive, double-blind review procedure. In order to submit the final version, at least one author of an approved work must register for the conference. All accepted papers will be included in the conference proceedings and submitted to IEEE Xplore for publishing consideration.

    Standard Conference Policies

    • If a paper is not presented at the conference, ICECA reserves the right to remove it from dissemination after the meeting (for example, by not submitting it in IEEE Xplore). Papers are assessed on the criterion that they are not plagiarized and have not been submitted to another conference at the same time (multiple submissions).
    • The conference can take any corrective or preventive action to publish the conference articles. The author is solely responsible for any post conference plagiarism and similarity issues.
    • Authors are allowed to post their article in their personal website and institutional repositories. However, once accepted for publication in IEEE, the posted article must be removed from any other third-party servers.
    • The author may not post the final published article online whereas it will be only available in IEEE Digital Xplore Library, which can be cited for any use.

    IEEE Plagiarism Policy (https://www.ieee.org/publications/rights/plagiarism/id-plagiarism.html)

    Possible plagiarism scenarios

    Potentially complicating the effort to identify plagiarism is the fact that each of the above basic factors can be combined with other factors, creating a range of possible plagiarism scenarios. Here, then, is a full list of possible scenarios, starting with the worst case:

    1. Uncredited Verbatim Copying of a Full Paper, or Uncredited Verbatim Copying of a Major Portion (more than 50%) within a Single Paper--An instance is where a large section of the original paper is copied without quotation marks, credit notice, reference, and bibliography. This case also includes instances where different portions of a paper are copied without attribution from a number of papers by other authors, and the sum of plagiarized material is more 50%, or

      Uncredited Verbatim Copying within More than a Single Paper by the Same Author(s)--This includes instances where more than one paper by the offending author(s) has been found to contain plagiarized content, and all the percentages of plagiarized material in each of the discovered papers sum to greater than 50%.

    2. Uncredited Verbatim Copying of a Large Portion (greater than 20% and up to 50%) within a Paper.--An instance is where a section of the original paper is copied from another paper without quotation marks, credit notice, reference, and bibliography. This case also includes instances where different portions of a paper are copied without attribution from a number of papers by other authors, and the sum of copying results in a large portion of plagiarized material (up to 50%) in the paper, or

      Uncredited Verbatim Copying within More than One Paper by the Same Author(s)--This includes instances where the sum of plagiarized material from the different papers would constitute the equivalent of a large portion (greater than 20% and up to 50%) of the discovered paper with the fewest words.

    3. Uncredited Verbatim Copying of Individual Elements (Paragraph(s), Sentence(s), Illustration(s), etc.) Resulting in a Significant Portion (up to 20%) within a Paper--An instance could be where portions of original paper are used in another paper without quotation marks, credit notice, reference, and bibliography.

    4. Uncredited Improper Paraphrasing of Pages or Paragraphs. Instances of improper paraphrasing occur when only a few words and phrases have been changed or when the original sentence order has been rearranged; no credit notice or reference appears with the text.

    5. Credited Verbatim Copying of a Major Portion of a Paper without Clear Delineation. Instances could include sections of an original paper copied from another paper; credit notice is used but absence of quotation marks or offset text does not clearly reference or identify the specific, copied material.

    Plagiarism, in short

    The extreme and more obvious cases notwithstanding, the above scenarios provide us with some basic determining factors we can use when attempting to deal with allegations of plagiarism between authors.

    • Amount or quantity does not play a part in defining plagiarism. However, the amount of material plagiarized should play an important part in determining the appropriate corrective action.
    • Credit notices or references are not sufficient to deflecting a charge of plagiarism if quotation marks or offset text have not been used to identify the specific material being copied.
    • Paraphrasing can leave an author open to a charge of plagiarism if he or she has changed only a few words or phrases or has only rearranged the original sentence order. Even a proper paraphrasing of the original text can lead to a charge of plagiarism if the original source is not properly cited.
    Travel Grant

    Travel grant will be afforded to the selected best (IEEE student members) research works.
    Technical Program

    To be announced.
    Regular Papers

    To be announced.
    Posters

    To be announced.
    Technical Visits

    To be announced.

    Sponsors:




    Registration Policies


    Registration Policy

    7th ICECA 2023 conference registration for members of IEEE and associated societies, and non-members includes the admission to all technical sessions in the 3-day conference event. The members of IEEE and associated societies should provide their E-Membership details or membership ID while submitting the registration documents. To publish the accepted article in 7th ICECA 2023 conference proceedings and to be eligible for publication in IEEE Xplore, at least one of the authors should register (either as a IEEE/ Non-IEEE) member and present the research work at the conference event.

    One registration allows authors to present and publish one paper in the conference. Please send the registration documents (Final paper, IEEE Copyright Form, and Payment Gateway (Paid) Screenshot). Making payment for the submitted paper before getting official conference acceptance letter is strictly prohibited.

    Conference Registration Form










    Benefits including for Registration Fee:

    Registration fee includes, participation in the conference, participation in the technical program [Keynote, all technical sessions], publication of the contribution, individual conference certificates, and a conference kit.


    Submit IEEE eCopyright





    Refund Policy

    After registration, no refunds or cancellations are granted.


    Registration Fee

    Category IEEE Members Non-IEEE Members
    Indian Participants (INR) UG/PG Students 6000 INR 6500 INR
    Research Scholars 6500 INR 7000 INR
    Academicians 7000 INR 7500 INR
    Industry Delegates 7500 INR 8000 INR
    Listeners 5000 INR 6000 INR
    Foreign Participants (USD) Authors 150 USD 200 USD
    Listeners 100 USD 150 USD


    Venue


    RVS Technical Campus
    Kumaran Kottam Campus,
    Kannampalayam,
    Coimbatore – 641 402,
    India.

    Local Attractions:

    Distance from:
    Coimbatore International AirportCoimbatore Railway Junction
    14 KM
    16 KM
    click here to view nearby tourist places

    News

    • Welcome

      The RVS Technical campus intends to be the preeminent research and teaching institution linking the people of our institutions to the nation and the world by providing quality, career focused education and world class specializations. To be a world class Institution for Engineering and Managerial Education by imparting quality education of global standards and formulate students academically superior, socially committed, ethically strong and culturally rich citizens.

    • a Reuben sandwich on wax paper.

      Keynote Speakers

      Dr. K. Porkumaran Chairman, IEEE Madras Section and Principal & Senior Professor, Sri Sairam Engineering College, Chennai, India.

      Dr. T. Muthumanickam Chair - Aerospace and Electronic Systems (AES) Society, IEEE Madras Section.

      Mr.S.Ayyappan Senior Manager - Avionics Design, HAL, Bangalore.

    Contact

    Dr. S D Prabu Ragavendiran,
    HoD - CSE,
    RVS Technical Campus,
    Coimbatore, India.

    Email: iceacconfteam@gmail.com
    Phone: +91-7708233150
    Whatsapp: +91-7708233150