3rd International conference on Electronics, Communication and Aerospace Technology
(ICECA 2018)

16-17, May 2019 | The Hotel Arcadia

3rd International conference on Electronics, Communication and Aerospace Technology
(ICECA 2018)

16-17, May 2019 | The Hotel Arcadia

3rd International conference on Electronics, Communication and Aerospace Technology
(ICECA 2018)

16-17, May 2019 | The Hotel Arcadia

Submission Date

17, March 2019

Notification of Acceptance

16, April 2019

Last date of registration

1, May 2019

Conference Date

16-17, May 2019

Call for Papers

Original and high quality research papers are solicited in all areas of Electronics, Communication and Aerospace Systems. We seek research full papers and posters on a broad range of topics, including but not limited to:

Informatics

Coding Techniques for 3G & 4G
UWB Systems
Digital Multimedia Systems
Airborne Vehicle Communication
Antenna Systems
Signal & Image Processing
Telemetry & Tele command Systems
Optical Communication
Satellite Technology
Earth Station Systems & Technology
Wireless Networks
Spectrum Management
Cognitive Radio Design
Millimeter Wave Technology
Telecom Management
Underwater Communication
Biomedical Signal Processing
Wavelets & Applications
Multi Carrier Modulation
MIMO Systems
Microwave Systems
Electromagnetics Engineering
Bio-computation Techniques
Cryptography
Switching
IOT
Big Data
Cloud Computing
Health care Informatics


Data Communication and Computer Networking

Cryptography
High Speed Networks
Mobile Computing
Mobile Networks & Wireless LAN
Optical Networking
Network Based Applications
Network Security
Next Generation Web
Recent Trends in Computer Networks
Wireless and Adhoc Network
Wireless Multimedia systems


Aerospace Technologies

Aerospace electronics
Avionics
Power systems
Electric/electronic components and distributors
Electric systems
Propulsion systems
Safety systems
Space systems
Unmanned aerial vehicle systems
Prognostics/diagnostics


Electronics Technologies

3D Process and Integration Technologies
Substrate Embedding & Advanced Flip-Chip Packaging
MEMS & Sensor Technologies
Wafer-Level CSP & Heterogeneous Integration
Design and Analysis of Power Delivery Systems
Novel Materials, Devices and 3D Interconnects
Wearable, Flexible, and Stretchable Electronics
Optical Interconnects & 3D Photonics
Digital System and Logic Design
Computer Architecture and VLSI
Networked-Driven Multicore Chips
Advance Robotics systems
Electrical Machines
Analog and Digital Electronics
Signals and Systems

Communication technologies

Wireless Networks
MIMO Systems
Microwave Engineering
Wireless Security
Computer networks
IOT and Cloud Computing
Artificial Intelligence / Semantic Web & Ontology
Grid Computing / Cloud Computing
High Performance Computing & Networks
Fuzzy Systems & Soft Computing
Computational methods, Algorithms & Scientific Applications